2017年IEEE先进电子系统封装与设计国际会议

Dec.14

Thursday

7:30-9:00

Registration

1st  Floor, Multimedia Hall

9:00-9:15

Opening Ceremony

Address from EDAPS Co-Chair：Er-Ping   Li

9:15-12:00 Keynote Presentations

9:15-10:00

Stochastic Electromagnetic Field Modeling for   EMI/EMC-Aware Design of Electronic Systems

Andreas C Cangellaris

10:00-10:30

Coffee Break

10:30-11:15

2D Materials for Smart Life

Kaustav Banerjee

11:15-12:00

Integrating thermal, electrical, and materials issues for   extreme-density power electronics

Philip T. Krein

12:00-13:30

Lunch

Rooms

201,

Lecture Theatre West

204,   

Lecture Theatre West

207,   

Lecture Theatre West

13:30-14:00

Tut1

Tut2-1

Wor4-1

14:00-14:30

Tut2-2

Wor4-2

14:30-15:00

Wor3-1

Tut2-3

Wor1-1

15:00-15:30

Wor3-2

Tut2-4

Wor1-2

15:30-15:50

Coffee Break

15:50-16:20

Wor3-3

Tut3-1

Wor1-3

16:20-16:50

Wor2-1

Tut3-2

Wor1-4

16:50-17:20

Wor2-2

Tut3-3

Wor1-5

17:20-17:50

Wor2-3

Tut3-4

Wor1-6

17:50-18:20

Wor2-4

Tut3-5

Wor1-7

18:30-21:00

Reception

Dec.15

Friday

Keynote Presentations

8:00-8:45

3D-IC Technology: Reliability Challenges and Biomedical Application

Tetsu Tanaka

8:45-9:30

Signal Integrity Designs of HBM in 3D Packaging

Jun Fan

9:30-9:50

Coffee   Break

Rooms

201,   LTW

204,   LTW

207,   LTW

9:50-12:10

Oral Session 1

Oral Session 2

Oral Session 3

12:10-13:30

Lunch

13:30-15:30

Poster：Multimedia Hall

Oral Session 4-1

Oral Session 6-1

15:30-15:50

Coffee   Break

15:50-17:50

Oral Session 4-2

Oral Session 5

Oral Session 6-2

19:00-21:30

Gala   Dinner/Best Paper Award Presentation

Dec.16

Saturday

Rooms

201,   LTW

204,   LTW

207,   LTW

8:00-10:00

Oral Session 7-1

Oral Session 8-1

Oral Session 9-1

10:00-10:20

Coffee Break

10:20-12:20

Oral Session 7-2

Oral Session 8-2

Oral Session 9-2

12:20-13:30

Lunch

13:30-15:30

Oral Session 10-1

Oral Session 11-1

Oral Session 12-1

15:30-15:50

Coffee Break

15:50-17:50

Oral Session 10-2

Oral Session11-2

Oral Session 12-2